Multi-layer HDI board
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Multi-layer HDI board
PCBA
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Specifications:

Layers: 8Thickness: 1.0mmMaterial: FR4 S1000-2Size: 290*216mmSurface treatment: Immersion goldLine width/spacing: 3/3milMinimum hole diameter: 0.10mmSolder mask color: photosensitive blueFinished copper thickness: inner layer 1 OZ ,outer layer 1 OZ

Features:

1. Blind and buried vias design, complex structure, second-degree HDI; blind holes L1-L2, L7-L8, buried holes L2-L3, L3-L6, L6-L7; through holes L1-L82. In the production process, need to do multiple times stack up, and the precision needs to be extremely high;